Machine Learning for Accelerating Semiconductor Packaging Simulation, Test, and Digital Twins
Thu, Jun 18, 2026 12:00 PM - 1:00 PM CDT
SmartUQ is a powerful AI, Machine Learning (ML) and Uncertainty Quantiļ¬cation (UQ) software tool used by many of the worldās largest semiconductor manufacturing companies. SmartUQās development for semiconductor packaging applications is driven to meet the needs and challenges facing practicing engineers at these companies.
In semiconductor packaging, engineers must often balance performance, reliability, manufacturability, and cost while working with computationally expensive simulations and limited test data. SmartUQ helps harness advanced ML and statistical tools to accelerate workflows, gain deeper insight into system behavior, and support more reliable, data-driven engineering decisions. SmartUQ can be used to optimize package, material, and process designs while accounting for real-world variability and uncertainty.
Through software demonstration examples and customer use cases this webinar will discuss how SmartUQās modern design of Experiments (DOEs), predictive ML models (aka surrogate models), and statistical calibration enables faster trade studies, improved understanding of sensitivity and variability, and practical UQ for semiconductor packaging applications, where extensive simulation or test data collection is often prohibitively expensive. The presentation will conclude with a Q&A session.

Presented by Gavin Jones, Principal Application Engineer
Gavin Jones serves as a Principal Application Engineer at SmartUQ, where he is responsible for performing simulation and AI work for clients in the automotive, aerospace, defense, semiconductor, and other industries. He is a member of the SAE Chassis Committee as well as the AIAA Digital Engineering Integration Committee. Gavin is also a key contributor in SmartUQās Digital Twin/Digital Thread initiative.